U-PURTM – A Metal-Free Combination of Several UPW Polishing Steps in a Multifunctional Reactor for the Removal of TOC and H2O2 Traces

Date Published: 2018 | Conference materials

Log in or Join UltraFacility to access this content

To access our resources you will need to be a member of UltraFacility, log in to your account or purchase a membership to view this content.

Already have an account? Log in

This presentation was given at the Ultrapure Micro 2018 annual conference. It was presented in the Ultrapure Water Production track, as part of the Solving Current UPW Challenges with Innovative Design Solutions session.

Companies: Ovivo , Applied University Furtwangen
Authors: Thomas Oppenlaender,
Tags: Hydrogen Peroxide (H2O2)Ion ExchangeTotal Organic Carbon (TOC)UPW Polishing

Related content

Technical journal archive | 2017
Can advanced oxidation technology help control TOC in semiconductor water?
Training series | 2018
End-of-Pipe Semiconductor Wastewater Reclaim
Training series | 2017
Ion Exchange Resins - How They Work, Why They Work and How They Don't Work
Conference material | 2022
What is Known About Urea Control in UPW Systems?​

Back to Technical Knowledge Base

Not an UltraFacility Member?

Be part of year-round collaboration and knowledge exchange. Get access to the full range of tools leveraged by facility representatives and leading global experts from across the supply chain.

Book a demo

Find out how you can leverage UltraFacility Portal to achieve your business objectives today.

Request a demo