Functional water solutions to enable advanced wet cleaning process for next-generation semiconductor device manufacturing

Date Published: 2021 | Conference materials

Log in or Join UltraFacility to access this content

To access our resources you will need to be a member of UltraFacility, log in to your account or purchase a membership to view this content.

Already have an account? Log in

This presentation was given as part of the Ultrapure Micro 2021 annual conference. It was given as part of the ultrapure water strand.

Authors: Hideaki Iino, Yusuke Oniki, Efrain Altamirano-Sanchez, Frank Holsteyns, Yuya Akanishi, Shota Iwahata
Tags: CopperScaling and CorrosionFoulingMetal Contamination

Not an UltraFacility Member?

Be part of year-round collaboration and knowledge exchange. Get access to the full range of tools leveraged by facility representatives and leading global experts from across the supply chain.

Book a demo

Find out how you can leverage UltraFacility Portal to achieve your business objectives today.

Request a demo