The latest on SEMI standards

Standard revisions:

• SEMI S23: The Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment, was published in October 2021. The update concerns guidance for tower-cooled cooling water, in instances heat is removed through a cooling system, and in combination with a chilled water system.
• SEMI MF81: Originally published in 2001, this standard was revised in December 2021. The revision concerns the four-point probe test method which can be applied to wafers for measurement of radial resistivity variation.
• SEMI MF154: The revision of this standard concerns the identification of structures and contaminants on specular silicon surfaces.
• SEMI P5: The revision of this standard covers requirements for pellicles used on photomasks or reticles used in photolithography.
• SEMI P40: This revised standard details the requirements for extreme ultraviolet lithography (EUVL) mask mounting.
• SEMI P48: This revised standard focuses on technical specification of fiducial marks, which can be used to reference defect locations on extreme ultraviolet (EUV) blanks.
  
  

New standards:

• SEMI E186: The standard, published in November 2021, concerns specifications for dimensions of mass flow controllers and meters with the ETHERCAT control protocol.
• SEMI E184: This standard, published in December 2021, defines the interface dimensions of a load port on semiconductor manufacturing equipment, where a 300mm Tape Frame front opening unified pod (FOUP) can be loaded and unloaded.
• SEMI E185: This standard published in December 2021, concerns the establishment of physical dimensions for Tape Frame front opening unified pods (FOUP) for transport of 300mm tape frames.