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Deconstructing the Challenges of Facility 2.0: Time-to-Market & Supply Chain Challenges in the Microelectronics Industry

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Webinar

Thursday, June 30th 2022

Online

Time-to-market has been a critical driver in the semiconductor industry for many years, driving technological competition between leaders in the market. However, current challenges go beyond typical reasons. The chip shortage provides unprecedented opportunity for all companies in the industry. Current market conditions require much larger manufacturing capacity, requiring massive expansion in the industry, resulting in unprecedented construction challenges. Facilities which are much bigger and complex than before must be built and commissioned in record times. All this is happening alongside geopolitical challenges and limited resources.

The goal of this UPM Community event is to reveal specific needs and opportunities in the industry. Collaboration between all involved will be critical to produce creative ways of delivering time-to-market execution and minimize inefficiencies.

Speakers

Alex Milshteen

Intel

Alex Milshteen is the Engineering and Commissioning Manager with Intel Arizona. He has over 20 years of experience in management, engineering, operation, and technology development in the advanced semiconductor industry. He is a technical expert in water, wastewater treatment, desalination, and water reuse in industrial applications. Alex is among a few Intel leads driving Intel global water management group pursuing aggressive corporate goals in water conservation.

Assaf Harel

Intel

Assaf Harel is Intel’s Supply Chain Program Manager for all the Intel’s constructions projects. Assaf has been working in the procurement and supply chain industry for the last 18 years. Assaf’s focusing on procurement and supply chain planning and execution, from material and execution planner to senior procurement and supply chain manager around the semiconductor industry. He has a BSc in Industrial Engineering with an emphasis in Information Systems from Ben-Gurion University, Israel.

Dave Buesser

FTD Solutions

Dave Buesser is the COO of FTD Solutions. He is a mechanical engineer from the University of Arizona, and he has spent his entire 27-year career driving advanced technology facilities forward. He began with a focus on semiconductor process piping design and proceeded to build likely the deepest experience in the industry on UPW distribution systems. He has led the design efforts for several UPW plants for greenfield semiconductor facilities and has also led many multi-discipline design teams on microelectronics facilities.