Project engineer for UPW optimization and conceptual design projects addressing capacity and performance for semiconductor clients. Former UPW system owner at a large semiconductor fabricator.

FTD Solutions

Dominic is the Intel Director of Construction responsible for managing Intel’s latest leading edge Wafer FAB construction Program at Intel’s Ocotillo Campus Phoenix AZ. This program is part of Intel’s $20b investment on the campus.


Dominic has 35 years’ experience in EPCC project delivery. 16 years working with EPCC firms Costain, Jacobs, Fluor, DPS and 20 years within Intel.


Dominic holds a BSc in Construction Technology and an MSc in Project management.




Intel

I am a professional chemical engineer located in Kansas City. I focused on water and wastewater treatment design for the first 15 years of my career before transitioning into engineering and project management where I have mainly managed large water and wastewater projects for 10 years.

Kiewit

Dave Buesser is the COO of FTD Solutions. He is a mechanical engineer from the University of Arizona, and he has spent his entire 27-year career driving advanced technology facilities forward. He began with a focus on semiconductor process piping design and proceeded to build likely the deepest experience in the industry on UPW distribution systems. He has led the design efforts for several UPW plants for greenfield semiconductor facilities and has also led many multi-discipline design teams on microelectronics facilities. Today, his focus is to bring world-class expertise coupled with unique tools to help solve the most pressing UPW and facilities challenges facing advanced industries.

Hideaki IINO is a Chief Researcher at KURITA WATER INDUSTRIES LTD, where he currently manages JDP activities with Interuniversity of MicroElectronics Centre (IMEC) in Belgium. I have been more than 10 years in the semiconductor industry on both the UPW technology and wet process business. I began my semiconductor career from developing particle reduction in UPW with a major component supplier, then subsequently learned the water purification and wet clean processes with IMEC. I have a lot of patents and conference presentations. I am a member of the IRDS UPW group.

Kurita Water Industries

Bernie Zerfas is a former facilities engineer at GLOBALFOUNDRIES. He has more than 30 years’ experience in the semiconductor industry with a primary focus on UPW and deionized water systems. Although his initial formal training was in chemistry and chemical engineering, he has had a wide variety of formal and informal educational experiences in a variety of technical disciplines. Mr. Zerfas is also an active member of the UPW sub-group of the ITRS; a recent area of focus has been organic and particulate contamination. His current other areas of responsibility include a spectrum of pollution control systems.

Dan’s almost three decades of experience as a facilities engineering manager, process engineer, design engineer, construction project manager and tool hookup design in the advanced technologies and semiconductor manufacturing industry has led to innovative solutions in his work. His innovations have resulted in industry-changing quality and cost savings breakthroughs, including defect reduction and innovative water reclaim and re-use systems. Dan is well established in the semiconductor industry as an Ultra-pure Water, UHP Chemical and Wastewater expert as shown in his leadership of industry roadmap and collaboration teams. He is certified by ASQ as a six sigma black belt. His roles include Co-Chair of International Roadmap for Device and Systems (IRDS) Yield Enhancement (YE) team, Co-Chair UPW SEMI Standards team, and UP Micro Conference Strategy Team. In addition to many industry publications, Dan also holds a patent for Reduction of Charging Induced Damage in Photolithography Wet Process.

Samsung Austin Semiconductor

Deena Starkel has B.S. in Environmental Science and M.S. in Environmental Engineering from the University of Idaho. She is a licensed Professional Environmental Engineer with 22+ years of experience in the semiconductor industry as a Facilities Chemical and Water Engineer for Micron Technology. Deena is currently working as a Member of Technical Staff Principal Water Engineer for Micron’s R&D facility and corporate headquarters in Boise, ID and is focused on UPW and wastewater treatment design, process engineering, and operations. Deena has been a member of the UPW IRDS and other groups since 2018.

Micron

Dr. Rushikesh (Rushi) Matkar is the Pathfinding Technologist for Water purification at Intel’s R&D Center in Hillsboro, OR and a corporate owner for the leadership roadmap of Intel's water management group. Responsible for driving solutions towards the success of Intel's high volume manufacturing roadmap. He is passionate about high purity delivery of utilities, IOT and advanced manufacturing. Between Academia and Industry, Rushi has extensive experience in bringing new IP to Market. Recently, Rushi successfully led the program to introduce EUV Lithography as a patterning solution for fabrication at Globalfoundries. He has served multiple roles within the leading nodes in technology management, operations and engineering management to help multiple technology nodes meet mass-market benefits.

Ovivo

Beau Farmer is the Chief Technical Officer at TSI Incorporated, a global leader in precision research, analytical, and measurement instrumentation headquartered in Shoreview, Minnesota. He leads TSI’s efforts to identify and develop emerging technologies through collaborations with universities, small businesses, and industry partners, as well as through strategic acquisitions. Under his leadership, these collaborations have produced new products and government-funded projects such as nanoparticle monitoring instrumentation, miniaturized water-based condensation particle counters, and nanoparticle–protein binding research. Beau earned his Ph.D. in Applied Physics from Cornell University in 1990 where his research focused on 

Defect Dynamics and Wear-Out in Ultra-Thin Dielectrics on Silicon

. Before joining TSI in 2003, he was a tenured physics professor at the New Jersey Institute of Technology (NJIT), with joint appointments at Rutgers and Columbia Universities. He served as principal investigator on over $5 million in research funding, including NSF CAREER, EPA, and state-sponsored MEMS initiative awards. He is a Senior Member of the IEEE, has authored more than 60 peer-reviewed publications and holds 16 U.S. patents.

TSI Incorporated

Please see my LinkedIn profile: https://www.linkedin.com/in/sergei-shatsman/

Dr. Sriram (Ram) Ramamoorthy is a Supply Chain R&D Engineer/Technologist in Intel’s Fab Materials Organization managing specialty chemicals and filtration. Prior to this role, Ram was a senior process technology development engineer in Intel R&D fab in Oregon developing front end wet etch processes. Ram is an active member in IRDS and SEMI task forces and standards team. Ram received his Ph.D in Chemical Engineering from Rensselaer Polytechnic Institute (Troy, NY).

Mike Schmidt

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