As computing workloads become more demanding, hyperscale data centers are shifting from air to liquid cooling to meet the thermal needs of high-performance computing (HPC) and AI systems. Traditional air cooling faces challenges with heat dissipation in densely packed environments, leading to inefficiencies and hotspots. In contrast, liquid cooling offers superior thermal management, efficiently handling the heat generated by modern GPUs and high-density CPUs. This transition is driving demand for reliable, high-performance cooling solutions.

This white paper examines the challenges of simplifying temperature measurement in data center cooling and highlights how modern instrumentation like Endress+Hauser’s iTHERM SurfaceLine TM611 can enhance these processes.